Neil Jablon is senior director, product management at Qualcomm Technologies, Inc., in San Diego, California, within the Qualcomm CDMA Technologies division. He leads product management for the Snapdragon™ chipset third-party hardware component ecosystem and Snapdragon™-based product development platforms. Neil and his extended team work closely with third-party hardware component vendors in China, Taiwan, Korea, Japan, North America, and Europe. Since establishment in 2011, this hardware ecosystem team verified over a thousand third-party hardware components for inclusion in a preferred vendor list targeted to Android smartphone and other OEMs.
Neil has held leadership roles in telecommunications with top global companies since 1986, including AT&T Bell Labs, AirTouch Communications, Vodafone Group, J-Phone Group (Tokyo), IBM Global Services (Beijing), and from 2006, Qualcomm. He holds a Ph.D. in electrical engineering from Stanford University, an MBA in general management from the UCLA Anderson School, and is an IEEE Senior Member. Neil is fluent in Chinese (Mandarin dialect) and achieved intermediate-to-advanced proficiency in Japanese.