Android Smartphone Third-Party Hardware Component Ecosystem Update

Android Smartphone Third-Party Hardware Component Ecosystem Update
Dr. Neil Jablon, Senior Director, Product Management, Qualcomm Technologies, Inc.
Wednesday 8:50 am - 9:10 am

Qualcomm offers a Preferred Vendor List (PVL) of third-party hardware components compatible with SnapdragonTM-based Android smartphone designs, including Qualcomm Reference Designs. This PVL numbers over 1,000 parts, covering the complete product roadmap, and includes memories, cameras, displays, touch panels, sensors, 3rd party RF components, crystals, and passive components.

This talk will highlight our recent additions to the PVL for memories, cameras, and sensors, as well as display trends. The PVL supports 43 different component types today. Our revamped end-to-end memory processes are now mature, resulting in essential zero backlog and even higher throughput. We began adding IoT (wearables) and Auto memories to our PVL. We opened a memory vendor-staffed lab in Shanghai. We often achieve 35-45 PVL cameras per Snapdragon platform. Front cameras are much more important now in the higher tiers, due to many new features. Vendor-tuned cameras are now being added to our PVL. The Spectra Module Program consistently achieves camera Dx0 scores in the 80s. Software and solutions are becoming more important for cameras, but certain vendor actions need to be taken to benefit. We now support over 50 sensor vendors. We will highlight three display trends: 1) emphasis on picture quality and user experience over raw resolution, 2) a push from XR (extended reality) to improve display requirements, and 3) the LCD-to-OLED transition.

Speaker: Dr. Neil Jablon
Senior Director, Product Management, Qualcomm Technologies, Inc.
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Neil Jablon is senior director, product management at Qualcomm Technologies, Inc. (QTI), in San Diego, California, within the Qualcomm CDMA Technologies division. He leads product management for the Snapdragon™ chipset third-party hardware component ecosystem, Snapdragon™-based product development platforms, and is a core member of the product management team building the QTI third-party software (ISV) ecosystem. Since 2011, Neil and his extended hardware team verified over a thousand third-party hardware components for inclusion in a preferred vendor list targeted to Android smartphone and other OEMs.

Neil has held leadership roles in telecommunications with top global companies since 1986, including AT&T Bell Labs, AirTouch Communications, Vodafone Group, J-Phone Group (Tokyo), IBM Global Services (Beijing), and from 2006, QTI. He holds a Ph.D. in electrical engineering from Stanford University, an MBA in general management from the UCLA Anderson School, and is an IEEE Senior Member. Neil is fluent in Chinese (Mandarin dialect) and achieved intermediate-to-advanced proficiency in Japanese.